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Copper Based Low Resistence Alloy Wire

Main Properties

    Grade
Property

NC003
CuNi1

NC005
CuNi2

NC010
CuNi6

NC012
CuNi8

MC012
CuMn3

NC015
CuNi10

NC020
CuNi14

NC025
CuNi19

NC030
CuNi23

NC035
CuNi30

NC040
CuNi34

NC050
CuNi44

Composition 
(%)

Ni

1

2

6

8

-

10

14.2

19

23

30

34

44

Mn

-

-

-

-

3

-

0.3

0.5

0.5

1

1

1

Cu

Bal.

Bal.

Bal.

Bal.

Bal.

Bal.

Bal.

Bal.

Bal.

Bal.

Bal.

Bal.

Max continuous Working Temperature(℃) 

-

200

220

250

200

250

300

300

300

350

350

400

Melting points
(℃)

1085

1090

1095

1097

1050

1100

1115

1135

1150

1170

1180

1280

Density
(g/cm3)

8.9

8.9

8.9

8.9

8.9

8.9

8.9

8.9

8.9

8.9

8.9

8.9

20℃ Resistency(μΩ.m) 

0.03±10%

0.05±10%

0.1±10%

0.12±10%

0.12±10%

0.15±10%

0.2±5%

0.25±5%

0.3±5%

0.35±5%

0.4±5%

0.50±5%

Tensile Srength
( Mpa)

≥210

≥220

≥250

≥270

≥290

≥290

≥310

≥340

≥350

≥400

≥400

≥420

Elongation
(%,>Φ1.0)

≥25

≥25

≥25

≥25

≥25

≥25

≥25

≥25

≥25

≥25

≥25

≥25

TCR 10-5/℃
(20-600℃)

<100

<120

<60

<57

<38

<50

<38

<25

<16

<10

0

<-6





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